Computation of Three-Dimensional Temperature Distribution and Thermal Analysis to Integrated Circuit Substrates
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Abstract:
The exact three di me nsional temperatu re distribution and thermal analysiS to inte-grated circuit substrates have been presen ted by means of numerical method of a fin ite difference.Thismethed.which will overcome the di fficuItv of mathematical deduction mav be consltieredas an analytical way aided by com puters for thermal design of electron ic compon ents.
