Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects
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TG453.9

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    Abstract:

    The common finite element method microcomputer software for simulation of the temperature field is developed by authors. It is used for calculating the temperature field duringthe mending process of iron casting defects by means of the dissolution-diffusion bonding technology. The correctness has been proved by testing results. This software has been used to analyse thecaused of hardness rising in heat effecting zone,and also find out the approach for solving the problem.

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陈星明 钱翰城.铸件溶解扩散焊补过程温度场的数值模拟[J].重庆大学学报,1996,19(4):71~76

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