Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects
Article
Figures
Metrics
Preview PDF
Reference
Related
Cited by
Materials
Abstract:
The common finite element method microcomputer software for simulation of the temperature field is developed by authors. It is used for calculating the temperature field duringthe mending process of iron casting defects by means of the dissolution-diffusion bonding technology. The correctness has been proved by testing results. This software has been used to analyse thecaused of hardness rising in heat effecting zone,and also find out the approach for solving the problem.
