The Experiment on Regular-temperature Curing Adhesive Containing Silicon

doi:10.11835/j.issn.1000-582X.2003.11.026

Home > Archive>Volume 26, Issue 11, 2003 >98-100. DOI:10.11835/j.issn.1000-582X.2003.11.026

The Experiment on Regular-temperature Curing Adhesive Containing Silicon
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                        10.11835/j.issn.1000-582X.2003.11.026
                    
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郑怀礼张海彦钱力刘克万周鹏.新型含硅常温固化胶粘剂的试验[J].重庆大学学报,2003,26(11):98~100

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