Effect of the Tem Perature on Properties of Porous Silicon Powder inChemical Etching Process
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O649.4 TQ560.1

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黎学明 郁卫飞 等.化学浸蚀温度对多孔硅粉理化性质的影响[J].重庆大学学报,2003,26(3):39~41

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  • Revised:January 18,2003
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