Waste FR4 printed circuit board recycling technology based on supercritical fluid carbon dioxide
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Abstract:
To create a model for recycling technology, a waste FR4 printed circuit board (PCB) recycling process employing supercritical fluid CO2 (SCFCO2) is studied using central composite design. The influence of temperature and treatment time on the PCB delamination ratio, latitudinal tensile strength of glass fiber sheets, and their synthesized effect are analyzed. The optimal temperature and treatment time for FR4 PCB recycling with SCFCO2 are found by building a quadratic polynomial equation model of output parameters in recycling technology. The accuracy of the derived optimal temperature and treatment time is validated by a series of experiments.
