Aimed at electronic packaging application, the different types of particles of Al2O3, AlN and SiC which the mean size is about 4 μm are selected and three types of composites are fabricated by squeeze casting method with the particle volume fraction is 40%. The results show that the microstructure of composites is dense and free of pores with the particle distribute uniformly. The mean linear coefficient of thermal expansion (CTE) of composites ranges from 11.51×10-6~18.62×10-6/K and increases with increasing temperature. The measured coefficient of thermal expansion of SiCp/2024 is lower than that of AlNp/6061 and Al2O3p/2024. The measured CTE values of Al2O3p/2024 composites agreed well with Kerner’s model, the CTE of AlNp/6061 is closer to the prediction by ROM, and the CTE of SiCp/2024 varies from lower limit to upper limit of Shapery’s model.