The junction temperature simulation assessment model of IGBT module in three-phase inverters

doi:10.11835/j.issn.1000-582X.2014.02.006

Home > Archive>Volume 37, Issue 2, 2014 >37-45. DOI:10.11835/j.issn.1000-582X.2014.02.006

The junction temperature simulation assessment model of IGBT module in three-phase inverters
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                        10.11835/j.issn.1000-582X.2014.02.006
                    
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Insulated gate bipolar transistor (IGBT) power module operating performance and reliability and its design of heat dissipation system in inverter are directly related to its operation junction temperature. Investigation of temperature of power device junc

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徐铭伟,周雒维,杜雄,周生奇.三相逆变器中绝缘栅双极型晶体管模块结温仿真评估[J].重庆大学学报,2014,37(2):37~45

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Received:September 12,2013
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Online: February 26,2014
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