Pressureless sintering performance and high temperature aging of formic acid-treated nano-copper

doi:10.11835/j.issn.1000-582X.2023.204

Home > Archive>Volume 46, Issue 11, 2023 >42-48. DOI:10.11835/j.issn.1000-582X.2023.204

Pressureless sintering performance and high temperature aging of formic acid-treated nano-copper
DOI:
                        10.11835/j.issn.1000-582X.2023.204
                    
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                        XU Yu1XU Yu
State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing 400044, P. R. China
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DAI Dongfang2DAI Dongfang
Key Laboratory of Optoelectronic Technology & Systems Under the Ministry of Education, Chongqing University, Chongqing 400044, P. R. China
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YANG Renbin2YANG Renbin
Key Laboratory of Optoelectronic Technology & Systems Under the Ministry of Education, Chongqing University, Chongqing 400044, P. R. China
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CHEN Xianping1,2CHEN Xianping
State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing 400044, P. R. China;Key Laboratory of Optoelectronic Technology & Systems Under the Ministry of Education, Chongqing University, Chongqing 400044, P. R. China
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WANG Ping1WANG Ping
State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing 400044, P. R. China
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Affiliation:1.State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing 400044, P. R. China;2.Key Laboratory of Optoelectronic Technology & Systems Under the Ministry of Education, Chongqing University, Chongqing 400044, P. R. China
Clc Number:TM223
Fund Project:Supported by National Natural Science Foundation of China (61404140404), Defense Advance Research Program of Science and Technology (Z20210023), and Scientific Research Fund of Chongqing Municipal Education Commission (Z20190213).

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Abstract:

A pressureless sintering process of copper nanoparticle based on the copper formate pyrolysis reaction was developed. The aim was to address challenges faced by the existing copper sintering technologies, such as copper oxidation and the need for additional pressure. Copper nanoparticles (Cu NPs) were treated with formic acid solution to generate dense copper formate films, which, upon sintering, formed Cu-Cu joints. Quality tests confirmed that a formic acid reaction time of 10 min, PEG solvent, substrate surface polishing with 0.048 mm sandpaper, and a heating rate of 5 ℃/min were the optimal sintering conditions. This approach achieved pressureless sintering of copper nanoparticles, yielding joints with a shear strength of 16.18 MPa and low resistivity of 570 μΩ/m. Even after a 200 h high-temperature aging test, the joints maintained a shear strength of 9.38 MPa, which verified the reliability of the sintering process. Therefore, this method presents a novel approach for realizing reliable interconnections in third-generation semiconductor chips.

Key words:formic acid treatment;pressureless sintering;nano copper;high temperature aging

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徐瑜,戴东方,杨仁彬,陈显平,王平.甲酸处理的纳米铜无压烧结性能及高温老化研究[J].重庆大学学报,2023,46(11):42~48

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Received:October 13,2022
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Online: November 28,2023
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