A fault detection method for partial chip failure in multichip IGBT modules based on turn-on delay time
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1.Shinan Power Supply Branch Company of State Grid Chongqing Electric Power Company, Chongqing 400000, P. R. China;2.State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing 400044, P. R. China

Clc Number:

TM46

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Supported by National Natural Science Foundation of China(5200070692), and National “111” Project(B08036).

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    Abstract:

    Multichip insulated gate bipolar transistor(IGBT) modules are widely used in high-power converters, where condition monitoring plays a crucial role in improving the reliability of power equipment. This paper proposes a fault detection method for identifying partial chip failures in multichip IGBT modules by analyzing variations in turn-on delay time. First, the influence of chip failure on the turn-on process is analyzed, establishing the relationship between chip failure and turn-on delay. Based on this relationship, a fault monitoring method is developed to correlate turn-on delay with the number of failed chips. The effectiveness of the proposed method is verified by experimental testing. The results show that this method is significant for improving the operational reliability of power converters.

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罗丹,陈民铀,赖伟,李涵锐,夏宏鉴.基于开通延时变化的多芯片IGBT模块部分芯片失效监测方法[J].重庆大学学报,2025,48(3):14~26

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History
  • Received:May 08,2023
  • Revised:
  • Adopted:
  • Online: April 15,2025
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