添加剂MPS和SPS及其与PEG、Cl -组合对铜镀层晶面取向的影响
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云南省应用基础研究计划资助项目(2013FZ089)


Copper coatings crystal orientation under the influence of additivesMPS, SPS and their combinations with PEG and Cl -
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    摘要:

    高择优取向的铜镀层具有优异的性能,镀层晶面择优取向受多种因素的影响,添加剂是影响铜镀层晶面取向的因素之一。在酸性CuSO4电解液中分别加入添加剂MPS(3-巯基-1-丙烷磺酸钠)和SPS(聚二硫二丙烷磺酸钠),及其他们与PEG(聚乙二醇)、Cl -组合的添加剂,在这系列电解液中,采用恒电流沉积方法,在0.040 A/cm 2和0.150 A/cm 2两个电流密度下,制备出了不同取向的铜镀层。X射线衍射实验结果表明:高电流密度0.150 A/cm 2,添加MPS+Cl -和SPS+Cl -得到了(220)全择优取向的Cu镀层。而添加MPS或SPS,或其他添加剂组合,如MPS+PEG、MPS+PEG+Cl -、SPS+PEG、SPS+PEG+Cl -,得到不同取向择优的镀层。优化添加剂组合是在电沉积过程中尽早实现高择优取向生长的有效方法。

    Abstract:

    Highly preferred orientation copper coatings show excellent functions. Many factors affect copper coatings’ crystal preferred orientation, and additives are one of the factors. Copper coatings were prepared at 0.040 A/cm 2 and 0.150 A/cm 2 by constant current, respectively. The electrolytes were acid CuSO4 solution with additives MPS (3-mercapto propane sodium sulfonate) or SPS(poly-2-sulfur-2-propane sodium sulfonate), and their combinations with PEG (polyethylene glycol) and Cl -. X-ray diffraction shows that (220) lattice plane fully preferred orientation is obtained at the higher current density 0.150 A/cm 2 with the combination of MPS+Cl - or SPS+Cl -. But different preferred orientations are obtained with only MPS or SPS, or other combinations, such as MPS+PEG, MPS+PEG+Cl -, SPS+PEG, SPS+PEG+Cl -. Using different combinations of additives is an effective method to obtain highly preferred orientation lattice planes earlier in the process of electrodeposition.

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魏泽英,王文静.添加剂MPS和SPS及其与PEG、Cl -组合对铜镀层晶面取向的影响[J].重庆大学学报,2014,37(9):100-105.

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  • 收稿日期:2014-07-20
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  • 在线发布日期: 2014-12-29
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